Packaged SMIP Smart Connector for Ectron Computers
Project Lead: Ectron Corporation
Member % Cost Share: 50.51%
CESMII % Cost Share: 49.49%
Duration: 9 Months
Developing a smart Profile for an Asset and a Smart packaged connector to connect the data captured on the edge with the SMIP platform with OPC/UA. Wave 4 project and this Wave 3 project will leverage work done in both cases.
Create a smart profile for a generic asset: Oven, bind the profile to the oven, connect the profile to the SM platform using ethernet IP on the OT side through the smart connector and OPC/UA on the IT side
- Ectron will develop a general-purpose smart profile for the SMIP for an Oven
- Ectron will also develop a smart connector that will be available on the ECT-ECI and ECT-GCI computers to connect to the SM platform
Key Tasks & Milestones
- Connected factory using SmartEYE™ and SMIP instance operating at Ectron Plant
- End to End connected factory using SmartEYE™ with EhternetIP to SMIP using OPC/UA
A plug and play solution for edge to SMIP using OPCA/UA and a generic smart profile of an asset along with a generic smart connector to take EthernetIP protocol end points to SMIP using OPC/UA.
CESMII will have a working plug and play flow using SmartEYETM as the edge IIoT platform that is a hybrid cloud plus edge deployment. A CESMII SM Profile™ for a Generic Asset such as Burn in Overn will be delivered A Smart Packaged Connector for the SMIP from Ethernet IP OT protocol will be delivered.