Capability Projects Add Functionality to the SM Innovation Platform and Components

 

Three Capability Project proposals have been selected for negotiations.  Capability Projects demonstrate the capabilities of the Smart Manufacturing Innovation Platform through real-world use cases.  Project teams leverage the CESMII technology infrastructure and provide all cost share.

  • Ectron will provide a Smart Connector between their hardware execution platform and CESMII’s SM Innovation Platform Edge connector, expanding CESMII’s capabilities to provide connectivity through OPC-UA and MQTT to equipment used by small and medium manufacturers.
  • ThinkIQ will develop an infrastructure, APIs and platform services to enable development and management of applications by members and technology partners in CESMII’s marketplace, contributing to broad adoption of the SM Innovation Platform by member organizations.
  • ThinkIQ will create a Microsoft Azure IoT solution to expand SM Innovation Platform’s connectivity to a number of both open and proprietary OT protocols and APIs (including MQTT) providing immediate access to large ecosystem of connectivity through the CESMII platform.

 

 

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