PROJECT LEAD: Ectron Corporation

PROBLEM STATEMENT: Developing a smart Profile for an Asset and a Smart packaged connector to connect the data captured on the edge with the SMIP platform with OPC/UA.   Wave 4 project and this Wave 3 project will leverage work done in both cases.

PROJECT GOAL: Create a smart profile for a generic asset: Oven, bind the profile to the oven, connect the profile to the SM platform using ethernet IP on the OT side through the smart connector and OPC/UA on the IT side

TECHNICAL APPROACH: 

  • Ectron will develop a general-purpose smart profile for the SMIP for an Oven​
  • Ectron will also develop a smart connector that will be available on the ECT-ECI and ECT-GCI computers to connect to the SM platform

KEY TASKS AND MILESTONES:

  • Connected factory using SmartEYE™ and SMIP instance operating at Ectron Plant​
  • End to End connected factory using SmartEYE™ with EhternetIP to SMIP using OPC/UA​
POTENTIAL IMPACTA plug and play solution for edge to SMIP using OPCA/UA and a generic smart profile of an asset along with a generic smart connector to take EthernetIP protocol end points to SMIP using OPC/UA

BENEFITS: CESMII will have a working plug and play flow using SmartEYETM as the edge IIoT platform that is a hybrid cloud plus edge deployment. A CESMII SM Profile™ for a Generic Asset such as Burn in Overn will be delivered A Smart Packaged Connector for the SMIP from Ethernet IP OT protocol will be delivered

 

Member % Cost Share CESMII % Cost Share Duration
50.51% 49.49% 9 Months

 

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