PROJECT LEAD: Ectron Corporation
PROBLEM STATEMENT: Developing a smart Profile for an Asset and a Smart packaged connector to connect the data captured on the edge with the SMIP platform with OPC/UA. Wave 4 project and this Wave 3 project will leverage work done in both cases.
PROJECT GOAL: Create a smart profile for a generic asset: Oven, bind the profile to the oven, connect the profile to the SM platform using ethernet IP on the OT side through the smart connector and OPC/UA on the IT side
TECHNICAL APPROACH:
- Ectron will develop a general-purpose smart profile for the SMIP for an Oven
- Ectron will also develop a smart connector that will be available on the ECT-ECI and ECT-GCI computers to connect to the SM platform
KEY TASKS AND MILESTONES:
- Connected factory using SmartEYE™ and SMIP instance operating at Ectron Plant
- End to End connected factory using SmartEYE™ with EhternetIP to SMIP using OPC/UA
BENEFITS: CESMII will have a working plug and play flow using SmartEYETM as the edge IIoT platform that is a hybrid cloud plus edge deployment. A CESMII SM Profile™ for a Generic Asset such as Burn in Overn will be delivered A Smart Packaged Connector for the SMIP from Ethernet IP OT protocol will be delivered
| Member % Cost Share | CESMII % Cost Share | Duration |
| 50.51% | 49.49% | 9 Months |