SMIC Event (Purdue): Smart Molding Technologies

Name: SMIC Event (Purdue): Smart Molding Technologies
Start: 2023-09-11T00:00:00+00:00
End: 2023-09-11T23:59:59+00:00

SMIC Event (Purdue): Smart Molding Technologies

Date
September 11, 2023Time
All Day EventOrganizer
Purdue University

SMIC Event (Purdue): Smart Molding Technologies

For more information please contact...

Nick Barendt
Executive Director, Institute for Smart, Secure and Connected Systems (ISSACS)
Co-Executive Director, IoT Collaborative
Case Western Reserve University
Thwing Center, Room 157C
10900 Euclid Avenue
Cleveland, Ohio 44106
TEL: (216)368-1809 FAX: (919) 515-5281
E-mail: nab2@case.edu

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